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Home > Products > Functions > Sealing / Encapsulation

Sealing / Encapsulation

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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N-PU 5801B-DD

N-PU 5801B-DD is a two-component, solvent-free polyurethane adhesive suitable for bonding and sealing a wide range of materials, with excellent adhesion to a variety of substrates, excellent impact resistance, excellent electrical resistance and weather resistance.

EW 6079LG-5GC

EW 6079LG-5GC is a one-part, thermal curing adhesive based on epoxy system.It is designed for BGA underfill and chip encapsulation. It provides excellent protection of solder joints from mechanical stress and thermal shock. It is compatible with flux residues of solder pastes.