N-PU 5801B-DD is a two-component, solvent-free polyurethane adhesive suitable for bonding and sealing a wide range of materials, with excellent adhesion to a variety of substrates, excellent impact resistance, excellent electrical resistance and weather resistance.

EW 6079LG-5GC is a one-part, thermal curing adhesive based on epoxy system.It is designed for BGA underfill and chip encapsulation. It provides excellent protection of solder joints from mechanical stress and thermal shock. It is compatible with flux residues of solder pastes.

N-Sil 8351, single-component, heat-curable, CIPG, nickel/carbon fiber-filled silicone system, good conductivity, sealing, electromagnetic shielding, electronic device enclosures

PW 1405MV-N14 is a one-part, solvent free, UV curing adhesive based on acrylate hybrid system. It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1504TH is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system. It is ideal for protection and insulation of assembled circuit boards.

EW 6651N3 is a two-part, solvent free adhesive based on epoxy system. It is ideal for bonding or potting of electronic components.

N-PU 5623(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates.

PW 1401-20 is a one-part, solvent free, UV fast curing adhesive based on acrylate system. It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1469F is a one-part, UV and moisture dual curing adhesive based on acrylate system. It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

N-PU 5668L-F is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

EW 6780MV is a one-part, UV and thermal dual curing adhesive based on epoxy system. It is ideal for applications on FPCB.

AW 2928M is a two-part adhesive based on acrylate system. It is ideal for structural bonding of various substrates such as plastic, metal, ceramic etc. Typical applications are automotive components bonding, thermoformed enclosures, metal fabrication/assembly, plastic fabrication, and computer assembly.

N-Sil 8518 is a one-part room temperature curing elastic adhesive that is based on MS polymers and free of tin compounds. It is very soft to absorb mechanical shock and vibration. Typical application is thermally conductive bonding of electric/ electronic components.

EW 6628M is a two-part, solvent free adhesive based on epoxy system. It is ideal for bonding or potting of electronic components.