EW 6709 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components.

PW 2466M is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2466E-2 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2453LM1 is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system.It is ideal for sealing or bonding of plastic, glass and metal, as well as protecting sensitive components against mechanical and environmental stress on PCB/FPCB and CCM.

PW 1401-14 is a one-part, solvent free, UV fast curing adhesive based on acrylate system.It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1428M is a one-part, solvent free, UV curing adhesive based on acrylate system.It is ideal for cured-in-place gasket for edge sealing and bonding applications.

Advanced packaging, also known as High Density Advanced Packaging (HDAP), employs advanced design concepts and integration processes to reduce wire interconnect lengths, reconstruct chip-level system packaging, and effectively enhance system functional density. Current advanced packaging technologie

PW 1446 is a one-component, solvent-free, acrylate-based in-line UV-curable gasket. The product is suitable for cushioning and sealing and is an optimal choice for silicone materials.

PW 1446C2 is a one-component, solvent-free, acrylate-based in-line UV-curable gasket. The product is suitable for cushioning and sealing and is an optimal choice for silicone materials.

PW 1446C3 is a one-component, solvent-free, acrylate-based in-line UV-cured gasket. The product is suitable for cushioning and sealing and is an optimal choice for silicone materials.

PW 1446C2M is a one-component, solvent-free, acrylate-based UV-curable adhesive. This product is suitable for temporary shielding protection.

PW 1460LV is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. This product is suitable for sealing and potting a wide range of materials that require excellent wetting and leveling properties.

CT 2288 UV is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288G1F is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288M UF is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.