CT 2288M is a one-component, solvent-free, UV-heated dual-curing adhesive based on acrylate hybrid systems. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288MB is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

PW 1516HV is a one-component, solvent-free, UV-heated dual-curing adhesive based on acrylate hybrid systems. The product is suitable for bonding a wide range of materials. Typical applications are the bonding of camera modules, lenses and filters.

EW 6326LT-B is a one-component, solvent-free, fast-heat curing epoxy adhesive at low or high temperatures. This product is suitable for sealing, bonding and protecting electronic equipment and components.

N-PO 5710-303 is a one-part silicone free, hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

N-PO 5716A is a one-part hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

N-PO 5710D5 is a one-part hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

PW 1465 is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. It is suitable for bonding plastics, glass, metals and FR4, as well as protecting solder joints and sensitive components on PCBs/FPCBs from mechanical stress.

PW 2464B-3 is a one-component, UV-humidity dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

N-Coat 5411-3 is a one-part, room temperature curing water-based emulsion.It is ideal for temporary masking for protection area before conformal coating process.

EW 6360H is a one-component, solvent-free, heat-curing epoxy adhesive. It is suitable for sealing, bonding and protecting electronic devices and components, such as chip bonding.

EW 6304H is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6310WO-1MB is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection ofelectronical devices and components, such as connector, chip, etc.

N-PU 5608BS is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5608S is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.