PW 1469F is a one-part, UV and moisture dual curing adhesive based on acrylate system. It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

N-PU 5668L-F is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

EW 6780MV is a one-part, UV and thermal dual curing adhesive based on epoxy system. It is ideal for applications on FPCB.

AW 2928M is a two-part adhesive based on acrylate system. It is ideal for structural bonding of various substrates such as plastic, metal, ceramic etc. Typical applications are automotive components bonding, thermoformed enclosures, metal fabrication/assembly, plastic fabrication, and computer assembly.

N-Sil 8518 is a one-part room temperature curing elastic adhesive that is based on MS polymers and free of tin compounds. It is very soft to absorb mechanical shock and vibration. Typical application is thermally conductive bonding of electric/ electronic components.

EW 6628M is a two-part, solvent free adhesive based on epoxy system. It is ideal for bonding or potting of electronic components.

EW 6706LT is a one-part, solvent free, thermal curing adhesive based on epoxy system. It is designed for bonding of various substrates when low curing temperature is required.

N-Sil 8130 is a one-part room temperature curing elastic adhesive that is based on silicone. It is ideal for heat dissipation and bonding fixation between the heating element and the heat dissipation device, as well as for the sealing protection of the heating element.