EW 6300HVN-11AF is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components as corner binding glue.

EW 6310WS-1 is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for magnetic component bonding and effectively controls the thickness of the adhesive layer.

EW 6330T is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components as corner binding glue.

EW 6365T is a one-component, solvent-free, heat-curing epoxy adhesive suitable for sealing, bonding and protecting electronic equipment and components, insulation materials for flip chip manufacturing, etc., with excellent dispensing fit, excellent flowability, high Tg and low CTE, excellent high temperature and high humidity resistance

EW 6625B is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components.

EW 6500C is a one-component, heat-cured, conductive adhesive based on sterling silver particles and epoxy systems. This product is suitable for chip bonding that requires conductivity and can be widely used in the semiconductor industry.

EW 6501C is a one-component, heat-cured, sterling silver microparticles based on epoxy system conductive adhesives. This product is suitable for chip bonding that requires conductivity and can be widely used in the semiconductor industry.

AW 2935 is a two-component acrylate system-based adhesive. This product is suitable for structural bonding of various substrates such as plastics, metals, and ceramics, and has hydrolyzable properties. It can be cured and molded between the sealing surfaces of the oxygen barrier material, effectively preventing loosening or leakage problems caused by vibration or shock.

PW 1465 is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. It is suitable for bonding plastics, glass, metals and FR4, as well as protecting solder joints and sensitive components on PCBs/FPCBs from mechanical stress.

PW 2464B-3 is a one-component, UV-humidity dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

EW 6360H is a one-component, solvent-free, heat-curing epoxy adhesive. It is suitable for sealing, bonding and protecting electronic devices and components, such as chip bonding.

EW 6304H is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6310WO-1MB is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection ofelectronical devices and components, such as connector, chip, etc.

EW 6311Y is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcement of electronic components.

EW 6312HV is a one-part, solvent free, thermal curingadhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components, such as the insulating material for magnet bonding, etc