EW 6329H is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6334 is a one-component, UV-heated dual-curing epoxy adhesive. The product is suitable for optical active focus scenarios, low shrinkage can cope with scenarios where high pixel cameras require low compensation, and is suitable for bonding substrates such as metal or engineering plastic PPS, with low adhesion attenuation after aging resistance.

EW 6345HSL is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for applications requiring structural bonding with high thermal conductivity.

N-PU 5608BS is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5608S is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.

N-PU 5612CB is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5630L(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-Sil 8539WF is a one-part room temperature curing elastic adhesive that is based on MS polymers and free of tin compounds.It is very soft to absorb mechanical shock and vibration. Typical applications are sealing or bonding of electric/ electronic components and other uses in which the use of tin compounds is restricted.