EW 6312HV is a one-part, solvent free, thermal curingadhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components, such as the insulating material for magnet bonding, etc

EW 6329H is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6345HSL is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for applications requiring structural bonding with high thermal conductivity.

N-PU 5608S is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.

EW 6079LG-5GC is a one-part, thermal curing adhesive based on epoxy system.It is designed for BGA underfill and chip encapsulation. It provides excellent protection of solder joints from mechanical stress and thermal shock. It is compatible with flux residues of solder pastes.

N-Sil 8350 is a two-part, thermal curing CIPG that is based on Ni/C filled silicone system.It is ideal for applications that require good electrical conductivity and sealing properties. Typical applications include EMI shielding for the housing of electronic devices.

N-Sil 8352 is a two-part, thermal curing CIPG that is based on Ni/C filled silicone system.It is ideal for applications that require good electrical conductivity and sealing properties. Typical applications include EMI shielding for the housing of electronic devices.

EW 6343 is a one-part, solvent free, UV and thermal dual curing adhesive based on epoxy system.It is ideal for sealing and bonding of camera component.

EW 6720MT is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for protection of chips as Dam adhesive.