EW 6709 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components.

Advanced packaging, also known as High Density Advanced Packaging (HDAP), employs advanced design concepts and integration processes to reduce wire interconnect lengths, reconstruct chip-level system packaging, and effectively enhance system functional density. Current advanced packaging technologie

CT 6310W is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components.

EW 6300HV is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components as corner binding glue.

EW 6300HVN-11AF is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components as corner binding glue.

EW 6310WS-1 is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for magnetic component bonding and effectively controls the thickness of the adhesive layer.

EW 6311B is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components.

EW 6326LT-B is a one-component, solvent-free, fast-heat curing epoxy adhesive at low or high temperatures. This product is suitable for sealing, bonding and protecting electronic equipment and components.

EW 6330T is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components as corner binding glue.

EW 6365T is a one-component, solvent-free, heat-curing epoxy adhesive suitable for sealing, bonding and protecting electronic equipment and components, insulation materials for flip chip manufacturing, etc., with excellent dispensing fit, excellent flowability, high Tg and low CTE, excellent high temperature and high humidity resistance

EW 6625B is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcing electronic components.

EW 6500C is a one-component, heat-cured, conductive adhesive based on sterling silver particles and epoxy systems. This product is suitable for chip bonding that requires conductivity and can be widely used in the semiconductor industry.

EW 6501C is a one-component, heat-cured, sterling silver microparticles based on epoxy system conductive adhesives. This product is suitable for chip bonding that requires conductivity and can be widely used in the semiconductor industry.

EW 6360H is a one-component, solvent-free, heat-curing epoxy adhesive. It is suitable for sealing, bonding and protecting electronic devices and components, such as chip bonding.

EW 6310WO-1MB is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection ofelectronical devices and components, such as connector, chip, etc.