N-PU 5608BS is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5612CB is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5630L(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5668 is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5668L is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5656B is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5103M3 is a one-part, UV and moisture dua curing conformal coating based on modified acrylate system.It is ideal for protection and insulation of assembled circuit boards.

N-Sil 8118W is a one-part room temperature curing elastic adhesive that is based on silicone.It is ideal for sealing of heating components.

PW 1463G1F is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of various materials, such as glass, PC, PCB, stainless steel. It is also a pressure-sensitive adhesive (PSA) and has high initial adhesion to a wide variety of substrates.

CT 7259-BTX15 is a one-part moisture curing cyanoacrylate instant adhesive.It is ideal for bonding hard-to-bond substrates where fast fixture speed is required. It is also good for bonding rubbers.

N-Sil 8351 is a one-part, thermal curing CIPG that is based on Ni/C filled silicone system.It is ideal for applications that require good electrical conductivity and sealing properties. Typical applications include EMI shielding for the housing of electronic devices.