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Home > Products > Curing Method > Moisture Curing

Moisture Curing

Chemistry Acrylate Epoxy Silicon Based PU Others

Curing Method UV Curing Moisture Curing Thermal Curing Two Components Others

Functions Structural Bonding Sealing / Encapsulation Thermally Conductive Electrically Conductive Others

Product Name

Description

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N-PU 5608BS

N-PU 5608BS is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5612CB

N-PU 5612CB is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.

N-PU 5630L(YD)

N-PU 5630L(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates.