PW 2464B-3 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

N-PU 5667F(W) is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5612TC is a one-part, solvent free, reactive hotmelt adhesive based on PU system.structural bonding of mobile electronic devices such as smartphones, tablets and laptops. The adhesive is pressure sensitive and gives good initial strength after bonding.

PW 2466M is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2466E-2 is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

PW 2453LM1 is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system.It is ideal for sealing or bonding of plastic, glass and metal, as well as protecting sensitive components against mechanical and environmental stress on PCB/FPCB and CCM.

CT 7255 is a one-component cyanoacrylate moisture-curing adhesive. The product is suitable for bonding a wide range of materials.

PW 1460LV is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. This product is suitable for sealing and potting a wide range of materials that require excellent wetting and leveling properties.

CT 2288 UV is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288G1F is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288M UF is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288M is a one-component, solvent-free, UV-heated dual-curing adhesive based on acrylate hybrid systems. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

CT 2288MB is a one-component, solvent-free, UV-heated dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing, potting, and bonding plastics, glass, metals, and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

PW 1516HV is a one-component, solvent-free, UV-heated dual-curing adhesive based on acrylate hybrid systems. The product is suitable for bonding a wide range of materials. Typical applications are the bonding of camera modules, lenses and filters.

EW 6304H is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.