Two-component solvent-free acrylic structural adhesive: excellent bond strength, excellent toughness and impact resistance, no flow

One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance

UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free

UV moisture-cured acrylic for bonding on a wide range of materials. Typical applications are camera modules, lens and IR filter bonding, rapid UV curing, followed by moisture curing to cover shadows, good flexibility and softness, IBOA-free

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

PW 2440MR is a one-component, solvent-free, UV-moisture dual-cure adhesive based on an acrylate hybrid system. It is suitable for sealing, potting and bonding plastics, glass, metal and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

N-PU 5663ST is a one-component, solvent-free, reactive hot melt polyurethane adhesive suitable for bonding and sealing a wide range of materials, pressure-sensitive, providing good initial strength, initial cooling and subsequent moisture curing, good chemical and environmental aging resistance, low viscosity and long open time.

EW 6329 is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding or sealing of electronic components

N-PU 5663 is a one-component, reactive hot melt polyurethane adhesive suitable for bonding and sealing a variety of materials, pressure-sensitive, providing good initial strength immediately after bonding, excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, low viscosity and fast curing

CollTech Flyer_Adhesive Solution for TWS_General_EN_20220711