N-Sil 8138TL is a one-part room temperature curing elastic adhesive that is based on silicone and free of tin compounds.It is ideal for sealing or bonding of electric/electronic components.

EW 6707S is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding of various substrates when low curing temperature is required. Typical application includes holder bonding for camera modules.

N-PO 5710-303 is a one-part silicone free, hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

N-PO 5716A is a one-part hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

N-PO 5710D5 is a one-part hot-melt adhesive based on polyolefin system.It is ideal for temporary masking for protection area before conformal coating process.

N-Coat 5411-3 is a one-part, room temperature curing water-based emulsion.It is ideal for temporary masking for protection area before conformal coating process.

N-PU 5812LE is a two-part, solvent free adhesive based on PU system.It is ideal for thermal conductivity applications, Typical application is cold plate bonding of electrical vehicle batteries.

N-Sil 8539WF is a one-part room temperature curing elastic adhesive that is based on MS polymers and free of tin compounds.It is very soft to absorb mechanical shock and vibration. Typical applications are sealing or bonding of electric/ electronic components and other uses in which the use of tin compounds is restricted.

Colltech 9001T-1 is a an alternative to many traditional chlorinated or high VOC solvents.It is extremely efficient in a large range of applications, such as resins manufacture clean up, foundry resins, industrial coil and can coatings, paint strippers. It can be used for general purpose industrial cleaning for heavily soiled substrates or as plastic manufacture and processing solvent.

FF 1705-3A is epoxy film. It could be widely used in the semiconductor industry. Typical application is isolated layer between mold compound and die.

N-PU 5623(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates.

N-PU 5668L-F is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5510YD is a two-part, solvent free foaming adhesive based on PU system. It is ideal for potting and encapsulation.Typical applications include potting of battery cell in EV battery modules,and other potting applications where low density and flameretardant UL94 V-0 are required.

Colltech 9001T is a an alternative to many traditional chlorinated or high VOC solvents. It is extremely efficient in a large range of applications, such as resins manufacture clean up, foundry resins, industrial coil and can coatings, paint strippers. It can be used for general purpose industrial cleaning for heavily soiled substrates or as plastic manufacture and processing solvent.