PW 1465 is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. It is suitable for bonding plastics, glass, metals and FR4, as well as protecting solder joints and sensitive components on PCBs/FPCBs from mechanical stress.

PW 2464B-3 is a one-component, UV-humidity dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

EW 6334 is a one-component, UV-heated dual-curing epoxy adhesive. The product is suitable for optical active focus scenarios, low shrinkage can cope with scenarios where high pixel cameras require low compensation, and is suitable for bonding substrates such as metal or engineering plastic PPS, with low adhesion attenuation after aging resistance.