N-PU 5668 is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5668L is a one-part, solvent free, reactive hotmelt adhesive based on PU system.It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5656B is a one-part reactive hotmelt adhesive based on PU system.It is ideal for structural bonding of mobile electronic devices such as smartphones, tablets and laptops.The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5623(YD) is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates.

N-PU 5668L-F is a one-part, solvent free, reactive hotmelt adhesive based on PU system. It is ideal for bonding and sealing of multiple substrates. The adhesive is pressure sensitive and gives good initial strength after bonding.

N-PU 5510YD is a two-part, solvent free foaming adhesive based on PU system. It is ideal for potting and encapsulation.Typical applications include potting of battery cell in EV battery modules,and other potting applications where low density and flameretardant UL94 V-0 are required.