Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity

N-Sil 8630M is a one-component thermal grease. It is a highly filled compound that is not flowing, has high thermal conductivity, low modulus and mechanical stress, is easy to coat and remove with alcohol or acetone, is resistant to high temperatures, has good high temperature cycle reliability, and has low oil permeability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength