EW 6360H is a one-component, solvent-free, heat-curing epoxy adhesive. It is suitable for sealing, bonding and protecting electronic devices and components, such as chip bonding.

EW 6304H is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is ideal for sealing, bonding, and protection of electronic devices and components, such as the insulating material for Flip-Chip manufacturing, etc.

EW 6310WO-1MB is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for sealing, bonding and protection ofelectronical devices and components, such as connector, chip, etc.

EW 6311Y is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for bonding or reinforcement of electronic components.

EW 6312HV is a one-part, solvent free, thermal curingadhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components, such as the insulating material for magnet bonding, etc

EW 6329H is a one-part, solvent free, low temperature curing or fast high temperature curing adhesive based on epoxy system.It is designed for sealing, bonding and protection of electronic devices and components.

EW 6334 is a one-component, UV-heated dual-curing epoxy adhesive. The product is suitable for optical active focus scenarios, low shrinkage can cope with scenarios where high pixel cameras require low compensation, and is suitable for bonding substrates such as metal or engineering plastic PPS, with low adhesion attenuation after aging resistance.

EW 6345HSL is a one-component, solvent-free, heat-curing epoxy adhesive. This product is suitable for applications requiring structural bonding with high thermal conductivity.

EW 6079LG-5GC is a one-part, thermal curing adhesive based on epoxy system.It is designed for BGA underfill and chip encapsulation. It provides excellent protection of solder joints from mechanical stress and thermal shock. It is compatible with flux residues of solder pastes.