AW 2935 is a two-component acrylate system-based adhesive. This product is suitable for structural bonding of various substrates such as plastics, metals, and ceramics, and has hydrolyzable properties. It can be cured and molded between the sealing surfaces of the oxygen barrier material, effectively preventing loosening or leakage problems caused by vibration or shock.

PW 1465 is a one-component, solvent-free, UV-humidity dual-curing adhesive based on acrylate hybrid systems. It is suitable for bonding plastics, glass, metals and FR4, as well as protecting solder joints and sensitive components on PCBs/FPCBs from mechanical stress.

PW 2464B-3 is a one-component, UV-humidity dual-curing adhesive based on an acrylate hybrid system. It is suitable for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stresses.

NOBELPLA 3705 is a two-part adhesive based on acrylate system.It is ideal for structural bonding of various substrates such as plastic, metal, ceramic, and wood etc.

N-PU 5103M3 is a one-part, UV and moisture dua curing conformal coating based on modified acrylate system.It is ideal for protection and insulation of assembled circuit boards.

N-Sil 8914R is a one-part,UV curing CIPG that is based on silicone system. It is ideal for UV-Cured-In-Place-Gasket for bonding and sealing applications. It is elastic and flexible after UV cured.

PW 1463G1F is a one-part, UV and moisture dual curing adhesive based on acrylate system.It is ideal for bonding of various materials, such as glass, PC, PCB, stainless steel. It is also a pressure-sensitive adhesive (PSA) and has high initial adhesion to a wide variety of substrates.

PW 1405MV-N14 is a one-part, solvent free, UV curing adhesive based on acrylate hybrid system. It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1602LV is a one-part, solvent free, UV curing adhesive based on modified acrylate system. It is ideal for bonding of plastic, glass and metals.

PW 1504TH is a one-part, solvent free, UV and thermal dual curing adhesive based on acrylate hybrid system. It is ideal for protection and insulation of assembled circuit boards.

PW 1401-20 is a one-part, solvent free, UV fast curing adhesive based on acrylate system. It is ideal for sealing and bonding of plastic materials where high moisture resistance is required.

PW 1469F is a one-part, UV and moisture dual curing adhesive based on acrylate system. It is ideal for bonding of plastic, glass, metal and FR4, as well as protecting solder joint or sensitive components against mechanical stress on PCB/FPCB.

AW 2928M is a two-part adhesive based on acrylate system. It is ideal for structural bonding of various substrates such as plastic, metal, ceramic etc. Typical applications are automotive components bonding, thermoformed enclosures, metal fabrication/assembly, plastic fabrication, and computer assembly.