Consumer Electronics

Typical applications include encapsulation and underfill of FPC and PCB components, bonding and sealing of camera modules, micro speakers and headphones.

Bonding and Reinforcement

  • Excellent adhesion to various substrates
  • High thixotropy or good flowability
  • Dual curing process: UV/heat curing
  • High bonding strength
  • Robust reliability
  • Compatibility with flux residues


  • Flexible encapsulation
  • Compatibility with flux residues
  • Good adhesion to various substrates
  • Excellent temperature and moisture resistance
  • High SIR, low Dk/Df values

CSP and Flip Chip Underfill

  • Good flowability
  • Rapid thermal curing process
  • High reliability
  • Low free-ion concentration
  • Environmentally friendly, halogen free, sulfur free
  • Compatibility with flux residues