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  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • CT 6310W
    [PDF]
  • Epoxy
  • White
  • 32.000
  • Fast cure, Toughened, High bonding Strength (metal), Low Dk/Df
  • Electronic component protection, FPC coating, Magnet bonding, Structural bonding, Reinforcement (Reflow cure)
  • CT 6309W
    [PDF]
  • Epoxy
  • White
  • 24.000
  • Fast cure, Toughened, High bonding Strength (metal/PET/PA/LCP/SPS)
  • Connector reinforcement, Structural bonding (Reflow cure)
  • EW 6318H
    [PDF]
  • Epoxy
  • Black
  • 3.500
  • Low viscosity, Narrow gap filling
  • Connector sealant
  • EW 6325H
    [PDF]
  • Modified Epoxy
  • Black
  • 170.000
  • Fast cure, Toughened, High bonding strength (PA/LCP/PCB/Metal), Resistance to moisture/weathering/thermal shock and mechanical stress
  • Component bonding, Reinforcement (Reflow/Wave solder cure)
  • EW 6326
    [PDF]
  • Epoxy
  • Black
  • 23.000
  • Low temperture cure, High bonding strength (SS/Magnets)
  • Bonding
  • EW 6328
    [PDF]
  • Epoxy
  • Black
  • 36.000
  • Low temperture cure, High bonding strength (SS/Magnets)
  • Bonding
  • EW 6336
    [PDF]
  • Epoxy
  • Blue
  • 32.000
  • UV + Thermal cure, High bonding strength (FPC/SS/PC/PCB), Protection against mechanical/environmental stress
  • Mechanical/Environmental protection on FPC/PCB
  • EW 6339
    [PDF]
  • Epoxy
  • Transparent
  • 500
  • UV + Thermal cure, Low shrinkage, Optically transparent, Good flowability, Low Viscosity
  • Optical component bonding/potting
  • EW 6341LV
    [PDF]
  • Modified Epoxy
  • Transparent
  • 12.000
  • UV + Thermal cure, Low shrinkage, Good impact resistance
  • Camera component bonding/sealing
  • EW 6625B
    [PDF]
  • Modified Epoxy
  • Black
  • 170.000
  • Fast cure, Toughened, High bonding strength (PA/LCP), Resistance to moisture/weathering/thermal shock and mechanical stress
  • Electronic component bonding, Protection of polymer substrates, Reinforcement (Reflow cure)
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • EW 6610
    [PDF]
  • Epoxy
  • Part A: Transparent
    Part B: Yellow
  • Part A: 3.500
    Part B: 2.000
    Mixed: 3.000
  • Low viscosity/hardness, Resistance to moisture/weathering and mechanical stress, Good flexibilty/flowability
  • Potting/protection of electronic components
  • EW 6615
    [PDF]
  • Epoxy
  • Part A: Black
    Part B: Light Yellow
  • Part A: 1.600
    Part B: 7.500
    Mixed: 18.000
  • Low CTE/shrinkage, Thixotropic, Resistance to moisture/weathering and mechanical stress
  • Bonding/potting of electronic components
  • EW 6616
    [PDF]
  • Epoxy
  • Part A: Black
    Part B: Grey
  • Part A: 10.750
    Part B: 9.700
    Mixed: 10.000
  • Soft, Flexible, Resistance to moisture/weathering and mechanical stress
  • Potting of electronic components (sensors/other devices) requiring extreme thermal shock conditions
  • EW 6619
    [PDF]
  • Epoxy
  • Part A: Transparent
    Part B: Transparent
  • Part A: 73.000
    Part B: 3.500
    Mixed: 11.000
  • Fast cure at RT, Electrical/environmental resistance, High transparency
  • Potting/protection of electronic components
  • EW 6627
    [PDF]
  • Epoxy
  • Part A: Milky
    Part B: Milky
  • Part A: Paste
    Part B: Paste
  • Good toughness, Thixotropic, Electrical/environmental resistance
  • Bonding of electronic components; Reinforcement (PCB/Power Supply/LED)
  • EW 6628
    [PDF]
  • Epoxy
  • Part A: Grey
    Part B: Grey
  • Part A: 370.000
    Part B: 125.000
    Mixed: 260.000
  • Fast cure at elevated temperature, Good Thermal Conductivity, High bonding strength (ABS/PC/PCB/SS), Electrical/environmental resistance
  • Bonding of electronic component; Thermally conductive potting
  • EW 6440
    [PDF]
  • Modified Epoxy
  • Part A: Black
    Part B: Light Yellow
  • Part A: 18.000
    Part B: 7.000
    Mixed: 13.000
  • Fast cure, Resistance to moisture/weathering/thermal shock and mechanical stress; High bonding strength (PA/Al/SS)
  • Structural bonding
  • EW 6645
    [PDF]
  • Modified Epoxy
  • Part A: Black
    Part B: Brown
  • Part A: 7.000
    Part B: 7.200
    Mixed: 15.000
  • Fast cure, Resistance to mechanical and thermal shock, High bonding strength (PVC)
  • Bonding/potting of plastic components
  • EW 6650
    [PDF]
  • Epoxy
  • Part A: Milky
    Part B: Transparent
  • Part A: 20.000
    Part B: 16.000
    Mixed: 25.000
  • Fast cure, Thixtropic, Electrical and environmental resistance
  • Potting of switching components
  • EW 6657
    [PDF]
  • Epoxy
  • Part A: Transparent
    Part B: Transparent
  • Part A: 11.000
    Part B: 200
    Mixed: 1.500
  • Fast cure at elevated temperture, Good flowability, High hardness
  • Potting for optical components
  • EW 6680
    [PDF]
  • Epoxy
  • Part A: Transparent
    Part B: Transparent
  • Part A: 11.000
    Part B: 13.000
    Mixed: 13.000
  • Fast cure, Good flowability, Environmental resistance
  • Potting for electronic components/chargers; Structural bonding
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • N-Coat 9560
    [PDF]
  • Modified Alkyd Resin
  • Slightly Yellow
  • 75
  • Low viscosity, Flexible, Good flowability, High bond stregth (FPC/PCB), Excellent electrical properties, Environmental resistance, Fluoresces under UV light
  • Protection/insulation of assembled circuit boards
  • N-PU 5103
    [PDF]
  • Modified Polyurethane
  • Transparent
  • 250
  • UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
  • Protection/insulation of assembled circuit boards
  • N-PU 5103H
    [PDF]
  • Modified Polyurethane
  • Transparent
  • 600
  • UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
  • Protection/insulation of assembled circuit boards
  • N-PU 5103M
    [PDF]
  • Modified Polyurethane
  • Transparent
  • 120
  • UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
  • Protection/insulation of assembled circuit boards
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • EW 6064
    [PDF]
  • Epoxy
  • Black
  • 400
  • Fast cure, Good flowability, Reworkable, Halogen-free
  • Underfill for BGA/CSP
  • EW 6066
    [PDF]
  • Epoxy
  • Black
  • 500
  • Fast cure, Good flowability, Reworkable, Halogen-free, High Tg
  • Underfill for BGA/CSP
  • EW 6068
    [PDF]
  • Epoxy
  • Black
  • 2.800
  • Fast cure, Halogen-free, High Tg
  • Underfill for BGA/CSP
  • EW 6360
    [PDF]
  • Epoxy
  • Black
  • 6.500
  • Good flowability, Halogen-free, High Tg, Low CTE, Compatible with lead-free solder paste, Excellent reliability
  • Underfill for BGA/CSP
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • CT 7255
    [PDF]
  • Ethyl Cyanoacrylate
  • Transparent
  • 2.500
  • Low odor/whitening, Minimal blooming, Flexible, Good bonding strength (rubber/metal/plastic), Good impact/heat/humidity resistance
  • Bonding
  • CT 7281
    [PDF]
  • Ethyl Cyanoacrylate
  • Transparent
  • 100
  • Fast fixture, Good bonding strength for difficult-to-bond substrates (wood/leather/fabric)
  • Bonding (porous materials)
  • CT 7283
    [PDF]
  • Ethyl Cyanoacrylate
  • Transparent
  • 30
  • Fast fixture, Good bonding strength to difficult-to-bond substrates (rubber/metal/plastic/elastomer/leather)
  • Bonding
  • CT 7286
    [PDF]
  • Ethyl Cyanoacrylate
  • Transparent
  • 2.500
  • Low odor/whitening, Minimal blooming, Good bonding strength (metal/plastic)
  • Bonding
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • N-PU 5605
    [PDF]
  • Polyurethane
  • White/Yellow
  • 4.000-6.000
  • Reworkable, High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for mobile devices
  • N-PU 5606
    [PDF]
  • Polyurethane
  • White/Yellow
  • 4.000-6.000
  • Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for mobile devices
  • N-PU 5608
    [PDF]
  • Polyurethane
  • White/Yellow
  • 3.000-5.000
  • High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for mobile devices
  • N-PU 5610
    [PDF]
  • Polyurethane
  • White/Yellow
  • 4.000-6.000
  • High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for mobile devices
  • N-PU 5618BL
    [PDF]
  • Polyurethane
  • Black
  • 3.000-5.000
  • Jet-dispensable, High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for mobile devices
  • N-PU 5626
    [PDF]
  • Polyurethane
  • White/Yellow
  • 4.000-8.000
  • Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for industrial/wooden furniture structures and PU foams
  • N-PU 5628
    [PDF]
  • Polyurethane
  • White/Yellow
  • 10.000-16.000
  • Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
  • Structural bonding for industrial/wooden furniture structures and home appliances
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • N-PU 5105
    [PDF]
  • Modified Polyurethane
  • White/Black
  • Paste
  • Fast cure, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties after water immersion
  • Flexible sealing/protection of components on PCB; FPC reinforcement
  • N-PU 5107
    [PDF]
  • Modified Polyurethane
  • White/Black
  • Paste
  • Quick fixation, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties after water immersion
  • Sealing/protection of components on PCB; Reinforcement of FPC; Bonding, Gap filling
  • N-Sil 8101W
    [PDF]
  • Silicone
  • White
  • 1.500
  • Fast cure, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties, Resistance to high temperature
  • Sealing/potting for FPC
  • N-Sil 8113
    [PDF]
  • Silicone
  • Transculent
  • Paste
  • Fast cure, Soft, Flexible, Excellent electrical properties after water immersion, Resistance to moisture/high temperature/various solvents
  • Sealing/protection of electronic components on PCB, Sealing of speaker enclosures, FPC reinforcement
  • N-Sil 8136
    [PDF]
  • Silicone
  • White/Black
  • Paste
  • Quick fixation, Resistance to high temperature
  • Sealing/protection of electronic components on PCB, PCB bonding, FPC reinforcement
  • N-Sil 8533
    [PDF]
  • Silicone
  • White/Black
  • Paste
  • Fast cure, Soft, Flexible, Resistance to moisture/high temperature/various solvents, Excellent electrical properties after water immersion
  • Sealing/bonding of components on PCB; FPC reinforcement
  • N-Sil 8551
    [PDF]
  • Modified Silicone
  • Black
  • Paste
  • Fast cure, Tin-free, High initial bond strength, Excellent impact/vibration resistance
  • Sealing/bonding of electronic components
  • N-Sil 8552
    [PDF]
  • Modified Silicone
  • Black
  • 16.000
  • Fast cure, Low viscosity, Tin-free, High initial bond strength, Excellent impact/vibration resistance
  • Sealing/bonding of electronic components
  • N-Sil 8556
    [PDF]
  • Modified Silicone
  • Black
  • 14.000
  • Fast cure, Low viscosity, Tin-free, Medium bond strength, Excellent impact/vibration resistance
  • Sealing/bonding of electronic components
  • N-Sil 8580
    [PDF]
  • Silicone
  • White/Black
  • Paste
  • Fast cure, Soft, Flexible, UL-94_V0, Excellent electrical properties, Resistance to high temperature/moisture/various solvents
  • Sealing/protection of electronic components on PCB; FPC reinforcement
  • N-Sil 8901
    [PDF]
  • Silicone
  • Transculant
  • Paste
  • Fast UV cure, Excellent permanent compression deformation, Resistance to high temperature
  • Sealing of electronic components, FIPG
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • N-Sil 8206
    [PDF]
  • Silicone
  • Part A: White
    Part B: Grey
  • Part A: 3.500
    Part B: 3.500
    Mixed: 3.500
  • Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
  • LED power supply encapsulation/potting
  • N-Sil 8215
    [PDF]
  • Silicone
  • Part A: White
    Part B: Grey
  • Part A: 10.000
    Part B: 10.000
    Mixed: 10.000
  • Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
  • High-power component potting, LED power supply encapsulation
  • N-Sil 8220
    [PDF]
  • Silicone
  • Part A: White
    Part B: Grey
  • Part A: 15.000
    Part B: 15.000
    Mixed: 15.000
  • High thermal conductivity, Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
  • Electrical power and High-power component potting, LED power supply encapsulation
  • N-Sil 8275
    [PDF]
  • Silicone
  • Part A: Red
    Part B: Red
  • Part A: 4.500
    Part B: 7.000
    Mixed: 6.000
  • Excellent heat resistance/shock resistance, High bonding strength (metal/ceramic); Low shrinkage/mechanical stress; High reliability
  • Auto power potting, PTC heater
  • N-Sil 8701
    [PDF]
  • Silicone
  • Part A: Transparent
    Part B: Transparent
  • Part A: 900 - 1.200
    Part B: 500 - 700
    Mixed: 700 - 1.000
  • High transparency/reliability, Good flowability, Low shrinkage/component stress, Excellent shock resistance
  • IGBT flexible potting
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • AW 2901
    [PDF]
  • Modified Acrylate
  • Part A: Orange
    Part B: Pink
  • Part A: 4.500
    Part B: 4.500
    Mixed: 4.500
  • Low odor, Low viscosity, Heat resistance, Good bonding strength (metal/ceramic/plastic/wood)
  • Structural bonding
  • AW 2902
    [PDF]
  • Modified Acrylate
  • Part A: Pale Yellow
    Part B: Blue
  • Part A: 15.000
    Part B: 15.000
  • Low odor, Excellent temperture/impact resistance/heat resistance, Good bonding strength (nickel-plated galvanized materials)
  • Structural bonding
  • AW 2903
    [PDF]
  • Modified Acrylate
  • Part A: Brown
    Part B: Green
  • Part A: 9.000
    Part B: 9.000
  • Fast cure, Low odor, Excellent water and heat resistance/impact resistance, Good bonding strength (steel/SS/aluminum/ceramic/FRP/Metals treated with high temperature baking finish)
  • Structural bonding
  • AW 2916
    [PDF]
  • Modified Acrylate
  • Part A: White
    Part B: Pale Green
  • Part A: 15.000
    Part B: 15.000
  • Low odor, High viscosity, Excellent heat resistance, Good bonding strength (metal/ceramic/plastic/wood)
  • Structural bonding
  • AW 2919
    [PDF]
  • Modified Acrylate
  • Part A: Milky-White
    Part B: White
  • Part A: 608.000
    Part B: 30.000
  • Low odor, Non-sagging, Excellent impact resistance/toughness, Good bonding strength (metal/ceramic/plastic)
  • Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
  • AW 2922M
    [PDF]
  • Modified Acrylate
  • Part A: Milky-White
    Part B: White
  • Part A: 40.000
    Part B: 42.000
  • Low odor, Non-sagging, Excellent toughness/impact resistance, Good bonding strength (metal/ceramic/plastic)
  • Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
  • AW 2925U
    [PDF]
  • Modified Acrylate
  • Part A: Blue
    Part B: Pale Yellow
  • Part A: 800.000
    Part B: 1.000.000
  • Fast cure, Excellent thermal conductivity/heat resistance, Good bonding strength (metal/ceramic/plastic)
  • Thermally conductive structural bonding
  • AW 2928
    [PDF]
  • Modified Acrylate
  • Part A: Pale Yellow
    Part B: Blue
  • Part A: 8.000
    Part B: 13.000
  • Non-sagging, Excellent toughness/impact resistance, Good bonding strength (metal/ceramic/plastic)
  • Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
  • AW 2943
    [PDF]
  • Modified Acrylate
  • Part A: Orange
    Part B: Blue
  • Part A: 6.000
    Part B: 6.000
  • Fast cure, Low odor, Excellent water/heat/moisture resistance; Long working temperature, Good bonding strength (plastic/ferrite/galvanized/nickel/chromium plated metals)
  • Structural bonding
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • N-Sil 8608
    [PDF]
  • Silicone
  • White
  • Paste
  • Low viscosity, Good gap filling performance, Moderate thermal conductivity, High temperture resistance, Removable
  • Power devices, LEDs
  • N-Sil 8615
    [PDF]
  • Silicone
  • Grey
  • Paste
  • Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
  • Power devices, LEDs
  • N-Sil 8620
    [PDF]
  • Silicone
  • Grey
  • Paste
  • Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
  • High-power LEDs, Thermalelectric devices
  • N-Sil 8630
    [PDF]
  • Silicone
  • Grey
  • Paste
  • Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
  • CPU/GPU, Heat sinks
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • CW 3705
    [PDF]
  • Epoxy
  • Silver
  • 3.600
  • Low viscosity, Low temperture cure, High Electrical conductivity, Flexible, Tack free
  • Electrically conductive gap filing/sealing
  • EW 6345CA
    [PDF]
  • Epoxy
  • Black
  • 350.000
  • Low CTE/shrinkage, High Thermal conductivity/temperature resistance
  • Thermal conductive bonding for ICs
  • EW 6345HDL
    [PDF]
  • Epoxy
  • Black
  • 50.000
  • Low CTE/shrinkage, High thermal conductivity/temperature resistance, Low Thermal cure
  • Thermal conductive bonding for ICs
  • EW 6345HS
    [PDF]
  • Epoxy
  • Black
  • Paste
  • High viscosity, Low CTE/shrinkage, High temperature resistance/thermal conductivity, Reworkable
  • Thermal conductive bonding for ICs
  • EW 6361
    [PDF]
  • Epoxy
  • Silver
  • 14.500-16.500
  • No stringiness/tailing, Low modulus, Hard but flexible, Lead-free reflow resistance
  • Electrically conductive die attach bonding
  • N-Sil 8735
    [PDF]
  • Silicone
  • Pink
  • Paste
  • One-part gel, Low modulus/mechanical stress/thermal impedance, High thermal conductivity/reliability, Good resistance to thermal cycling, Removable
  • Power mudule, Computer
  • N-Sil 8742
    [PDF]
  • Silicone
  • Part A: Pink
    Part B: White
  • Part A: 350.000
    Part B: 250.000
    Mixed: 300.000
  • Two-part gel, Contours easily to complex shapes, High thermal conducvity, Wet surface, Easy to dispense/apply, Removable
  • Power mudule, Computer
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • CT 2288
    [PDF]
  • Acrylate
  • Transcluent
  • 9.000-13.000
  • Thixotropic, Low shrinkage/stress, Flexible, Soft, Resistance to moisture/heat/weathering/thermal shock
  • Sealing, Bonding, Potting, Solder joint protection
  • PW 1008
    [PDF]
  • Acrylate
  • Transparent
  • 250
  • UV/Visible light cure option, Fluorescent under UVA light, High bonding strength (ABS/PC/PETG/PMMA),
  • Medical grade: Sealing, Bonding, Potting
  • PW 1081
    [PDF]
  • Acrylate
  • Transparent
  • 3.000
  • UV/Visible light option, Soft/flexible/transparent once cured, , Fluorescent under UVA light, High bond strength (ABS/PC/PETG/PMMA)
  • Medical grade: Sealing, Bonding, Potting
  • PW 1422
    [PDF]
  • Modified Acrylate
  • Black
  • 1.000
  • Flexible, Water proof (IPX7), Mechanical shock resistance, High bonding strength (SS/Glass)
  • Sealing (screws), Bonding (battery cell), Potting (plastics/metals)
  • PW 1435
    [PDF]
  • Modified Acrylate
  • Transparent
  • 5.600
  • Resistance to humidity/water immersion, High bonding strength (glass/Al)
  • Sealing/Bonding/Potting of glass/Al
  • PW 1436
    [PDF]
  • Modified Acrylate
  • Black
  • 6.000
  • Flexible, Soft, Resistance to heat/humidity
  • Solder joint protection
  • PW 1442
    [PDF]
  • Modified Acrylate
  • Milky
  • 14.000
  • Flexible, Resistance to mechanical shock, High bonding strength (PC/PMMA/ABS/SS)
  • Sealing/Potting of metals/plastics, Bonding (battery cell)
  • PW 1446M
    [PDF]
  • Modified Acrylate
  • Transparent/Blue
  • 36.000
  • Elastic, Fexible, Waterproof (IPX7), High bonding strength (PC/glass/Al)
  • Sealing/FIPG/Edge sealing, Bonding
  • PW 1448
    [PDF]
  • Modified Acrylate
  • Blue
  • 17.500
  • Reworkable
  • Temporary surface protection
  • PW 1450
    [PDF]
  • Acrylate
  • White
  • 5.000
  • Low shrinkage/stress, High Thermal Conductivity, Resistance to moisture/weathering/thermal shock and cycling loads, High bond strength (PCB/Al)
  • Sealing/Bonding/Potting/ requiring thermal conductivity.
  • PW 1451
    [PDF]
  • Modified Acrylate
  • Transparent
  • 1.000
  • Resistance to humidity/water immersion, High bond strength (PC/ABS/PMMA)
  • Sealing (glass-glass), Bonding
  • PW 1460
    [PDF]
  • Modified Acrylate
  • Transparent/Transcluent
  • 12.000
  • Medium hardness, Flexible, Secondary moisture cure for shadowed areas
  • Sealing/Bonding/Protection of PCBs and other electronic components
  • PW 1475
    [PDF]
  • Modified Acrylate
  • Light Yellow/Transparent
  • 1.600
  • Resistance to humidity/water immersion, High bond strength (PC/PVC/PMMA/glass), Sealing (PVC)
  • Sealing, General bonding
  • PW 1482M
    [PDF]
  • Modified Acrylate
  • Transparent
  • 2.000
  • Resistance to humidity/water immersion, High bonding strength (PC/Al/glass)
  • Sealing, Bonding, Potting (glass-glass)
  • PW 1485N
    [PDF]
  • Modified Acrylate
  • Transcluent
  • 6.200
  • Low UV energy cure, Resistance to humidity/water immersion, High bonding strength
  • Bonding (camera lens)
  • PW 1504
    [PDF]
  • Modified Acrylate
  • Transparent
  • 1.000
  • Resistance to humidity/water immersion, High bonding strength (PC/Al/MMA)
  • Sealing, Bonding, Potting
  • PW 1516HV
    [PDF]
  • Modified Acrylate
  • Transparent/Transcluent
  • 16.500
  • Low UV energy/temperature cure, Resistance to moisture/temperature/mechanical shock, High bonding strength (PC/PMMA)
  • Camera module/Lens bonding, IR filter
  • PW 1516NF
    [PDF]
  • Modified Acrylate
  • Transparent/Transcluent
  • 16.500
  • Low UV/Heat cure, Resistance to moisture/temperature/mechanical shock, High bonding strength (PC/PMMA)
  • Camera module/Lens bonding, IR filter
  • Name
  • Chemical Type
  • Appearance
  • Viscosity @
    25°C[mPa•s]
    110°C[mPa•s]
  • Features
  • Applications
  • PW 2401
    [PDF]
  • Modified Acrylate
  • Black
  • 18.000
  • Low hardness, High Tg/toughness, Excellent temperature and humidity performance, Sweat-resistant
  • Camera module/Sensor bonding