As smartphone cameras evolve toward multi-lens arrays and periscope zoom, and ADAS systems demand higher-resolution sensing, camera module assembly has become one of the most demanding applications in micro-bonding. Achieving sub-micron optical alignment while ensuring long-term mechanical and environmental reliability requires adhesives engineered specifically for Active Alignment (AA) and Die Attach (DA) processes. CollTech provides a comprehensive portfolio of optical-grade adhesives tailored for these critical assembly steps.

Key Challenges in Camera Module Assembly:

1. Sub-Micron Alignment Tolerance: AA process demands <3μm positional accuracy after curing; any adhesive shrinkage or stress-induced deformation directly degrades MTF performance.

2. Multi-Substrate Compatibility: Modules integrate LCP, ceramic, metal, glass, and FPC materials with vastly different CTEs; adhesives must maintain adhesion across all interfaces without delamination.

3. High-speed production needs: Modern AA production lines require non-stick time to match the production pace and to solidify quickly to meet production goals.

4. Sensor Protection Requirements: Adhesives must exhibit ultra-low outgassing to prevent fogging on CMOS sensors, and be halogen-free to avoid corrosion of wire bonds and solder joints.

5. Environmental Reliability: Modules must survive -40°C to +85°C thermal cycling, 85°C/85%RH damp heat aging, and mechanical shock without optical axis shift or bond failure.

Solution:

1. AA Active Alignment Bonding: Lens barrel-to-holder and holder-to-sensor bonding requiring ultra-low shrinkage (<0.1%), precise rheology control for gap filling, and dual UV/thermal cure for shadow area curing.

2. DA Die Attach: Image sensor and ISP chip attachment demanding high thermal conductivity, low modulus stress relief, and excellent wetting on bare silicon and substrate pads.

3. IR Filter & Cover Glass Bonding: Optical component sealing requiring high transparency, low autofluorescence, and particle-free dispensing to avoid image defects.

4. FPC Reinforcement & Strain Relief: Flexible circuit anchoring at module edges requiring high flexibility, peel strength, and resistance to repeated bending fatigue.

5. Lens Barrel Thread Locking: Preventing focus drift under vibration using low-viscosity wicking adhesives with controlled torque retention.

Typical Products:

EW 6364HS is a heat-curing epoxy adhesive. This product is designed for sealing, bonding, and protecting electronic components, and it's especially suitable for image sensor packaging that's sensitive to thermal shock.

• Meets VOC limits, safe and environmentally friendly, solvent-free

• Low-temperature heat curing

• Thixotropic, controllable flow

• Excellent adhesion to various substrates

• Outstanding resistance to thermal shock

PW 2452-1 is a UV-curable acrylate adhesive that can quickly cure under UV light, while also having thermal curing capabilities. It maintains stable performance across a wide temperature range from -40°C to 150°C, offering excellent moisture resistance, weather resistance, and thermal shock resistance. This ensures that camera modules work reliably in all kinds of extreme environments, and it also shows excellent adhesion to various substrates like plastic, glass, and metal.

• Meets VOC limits, safe and environmentally friendly, solvent-free  

• Single-component acrylic hybrid system, cures with UV light or heat  

• Thixotropic, flow can be controlled  

• Excellent adhesion strength on various substrates  

• Great electrical properties and resistance to thermal shock

CollTech EW 6510 Series: 

The EW 6510A-1 and EW 6510-9B both use a single-component UV/thermal dual-curing technology, making them suitable for bonding key components like glass lenses, metal brackets, and PCB substrates. Both products feature fast UV curing and low-temperature thermal curing, meeting production line requirements. Their high shear strength and excellent temperature resistance provide reliable structural support for camera modules under dynamic conditions like vibration and impact.

EW 6510A-1:

• Meets VOC restrictions, safe, eco-friendly, solvent-free

• Single-component epoxy system, dual-curing with UV light and heat

• Low shrinkage, high Tg

• Excellent bonding strength on various substrates

• Outstanding electrical performance and resistance to thermal shock

EW 6510-9B:

• Meets VOC restrictions, safe, eco-friendly, solvent-free

• Black formula design, light-shielding

• Low shrinkage, high Tg

• Excellent bonding strength on various substrates

• Outstanding electrical performance and resistance to thermal shock

For more information, please contact us.