One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

UV-curable acrylic for sealing and bonding glass to a variety of substrates. Typical applications are camera lens and housing bonding, low UV curing energy, excellent bond strength, excellent moisture resistance, and easy application in a variety of ways

UV-curable acrylic for PC sealing and bonding on a variety of materials, excellent bonding strength, excellent moisture resistance, easy to apply in a variety of ways

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

EW 6364 is a one-component, solvent-free, heat-curing epoxy adhesive suitable for use as a basefill to protect chips, with good adhesion to a variety of substrates, excellent high temperature and moisture resistance, high Tg and low CTE

PW 2452-1 is a one-component, solvent-free, UV-heated, dual-curing adhesive based on an acrylate hybrid system, with excellent moisture resistance, environmental aging, temperature wash, and high and low temperature cycling properties, excellent adhesion to a variety of substrates such as plastics, glass, metals, thixotropic properties, and controllable flowability

EW 6707S is a one-part, solvent free, thermal curing adhesive based on epoxy system.It is designed for bonding of various substrates when low curing temperature is required. Typical application includes holder bonding for camera modules.

PW 1516HV is a one-component, solvent-free, UV-heated dual-curing adhesive based on acrylate hybrid systems. The product is suitable for bonding a wide range of materials. Typical applications are the bonding of camera modules, lenses and filters.

EW 6334 is a one-component, UV-heated dual-curing epoxy adhesive. The product is suitable for optical active focus scenarios, low shrinkage can cope with scenarios where high pixel cameras require low compensation, and is suitable for bonding substrates such as metal or engineering plastic PPS, with low adhesion attenuation after aging resistance.

Typical Solutions