Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

UV-curable acrylic for sealing and bonding glass to a variety of substrates. Typical applications are camera lens and housing bonding, excellent shock or vibration resistance, and low shrinkage and stress during curing

CollTech Flyer_Adhesive Solution for Type-C Connector_General_EN_20220711